Still Problematic LED High Bay High Power Chip Radiation (II)

        The choosing of  led high bay    chips encapsulation method, material, structure and technology are mainly decided by factors like chip structure, mechanical character, actual application and cost. After many years of development, LED encapsulation has gone through the periods of lamp LED, SMD LED and Power LED. With the enlarging chip power, especially with the demand for solid-state lighting technology development, there are now new and higher requirements for the optical, thermal, electric and mechanical aspects of LED encapsulation. In order to effectively reduce thermal resistance and improve light efficiency, new technology must be invented for encapsulation.