Still Problematic LED High Bay High Power Chip Radiation (II)

Time:2015/12/27  keywords:LED High Bay


        The choosing of  led high bay    chips encapsulation method, material, structure and technology are mainly decided by factors like chip structure, mechanical character, actual application and cost. After many years of development, LED encapsulation has gone through the periods of lamp LED, SMD LED and Power LED. With the enlarging chip power, especially with the demand for solid-state lighting technology development, there are now new and higher requirements for the optical, thermal, electric and mechanical aspects of LED encapsulation. In order to effectively reduce thermal resistance and improve light efficiency, new technology must be invented for encapsulation.


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Sports Light & Flood light
    NEW Edge™ Glare-free Tennis Court Light
    NEW Edge™ 180LPW Sport & Flood Lighting
    NEW Edge™ 160LPW Sport & Flood Lighting
    LitePro™ 140LPW Sport & Flood Lighting
Roadway Lighting
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    Oasis™ 160LPW Street Light
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High Bays for 80°C/176°F Ambient Temp
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    Edge™ 130LPW 80°C High Bay
Engineering & Heary-duty Lighting
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    LED Victor™ With Emergency Power Pack
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High Bays for General Uses
    Grapheneism™ 140LPW UFO High Bay
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    Apollo™ 170LPW High Bay
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