The design of high power led high bay encapsulation is mainly on the optical, thermal, electric, structural and technological aspects. Those factors are independent and influential to each other. Among those aspects, light is the objective of encapsulation, heat is the key, electricity, structure and technology are methods, and performance is the indication of encapsulation level. As far as technology compatibility and production cost are concerned, the design of encapsulation and chips should go together, which means encapsulation structure and technology should be considered when designing the chips. Specifically, the key technology of high power LED encapsulation is low thermal resistance encapsulation. Since chips of LED Lights are of small size, the radiation of chip is the key problem to be solved in encapsulation.