At the present time, more and more people focus their eyes on LED light. However, it still has the problem of non-uniformity luminance and short lifetime so that it can’t give full play to the expected application advantage. Then how to solve the problem of LED heat dissipation so as to improve luminous efficiency? There are two methods up to now, one is improve the area of LED chip in order to increase the luminous quantity, and the other is to package several small chips into one module.
Improving chip area
In fact, improving chip area is able to get much higher luminance. However, it may get just the opposite because of the large are. According to such problem, some manufactories achieve high luminous efficiency by improving the quality of chip surface. Of course, it needs to pay much attention to the size of LED chip which could give full play the best luminous efficiency during taking light. That is because when the light in the internal chip spreads outside, the improving part of chip is unable to reflect.
Packaging several small chips
Compared with large LED chip, it is able to reach the requirement of highlight by packaging several small power chips into one module. But the next problem is that it must imbed some insulating material to avoid short circuit between LED chips. As a result, it would increase much more cost. In order to get higher luminous efficiency, the packaging material is also need to improve except LED chip. It’s estimated that most packaging material of led high bay have already used epoxy resin.